Introduction to IC Lead Straightening Machine:

The IC lead straightening machine places ICs with deformed leads into specially designed chip positioning fixture slots.

It then aligns with high-precision straightening combs that match the lead pitch of SMT chips in various package types. By retrieving the stored lead straightening process parameters from the device's computer,

the machine drives the robotic arm to perform high-precision X/Y/Z-axis straightening, correcting the deformed leads of the IC in the slot both laterally (pitch) and vertically (coplanarity). After one side is completed,

the operator uses a suction pen to flip the IC to the other side for automatic repair until all leads are straightened.

Technical Parameters of IC Lead Straightening Machine:

1. Changeover time: 5-6 mins

2. Types of straightening combs: 0.4mm, 0.5mm, 0.635mm, 0.65mm, 0.8mm, 1.0mm, 1.27mm, 2.54mm

(Select comb based on lead pitch)

3. Chip positioning fixture size: Positioning tolerance ≤ 0.05mm (Select fixture based on chip type)

4. Applicable chip types: QFP, LQFP, RQFP, TQFP, QSOP, TSSOP, TSOP, SSOP, SOP, SOIC, SO,

SOL, DL, PGA, and other IC package types

5. Chip body size range: 5mm×5mm—50mm×50mm

6. Lead pitch range: 0.4mm—2.54mm

7. Lead straightening deviation range: ≤ ± lead width × 26.7%

8. Straightening accuracy: ±0.03mm

9. Coplanarity of straightened leads: ≤ 0.1mm

10. Power supply: 100-240V AC, 50/60Hz

11. Microscope field of view and magnification: 60*60mm, 1-60x

12. Device dimensions: 760mm(L) × 700mm(W) × 760mm(H)

13. Operating temperature: 25°C ±10°C, suitable for lab and field environments

14. Humidity: 20% -- 60%

Performance Features of IC Lead Straightening Machine:

1. Capable of straightening leads for chips in packages such as QFP, LQFP, RQFP, TQFP, QSOP, TSSOP, TSOP, SSOP,

SO, SOP, SOIC, SOL, DL (SSOP), etc.

2. Manual placement of IC into chip positioning fixture, with elastic mechanism to automatically secure the chip, preventing movement that could cause straightening failure while avoiding damage to the chip.

3. Automatic lateral (pitch) and vertical (coplanarity) straightening and repair of IC leads, no manual adjustment required.

4. Pre-stored straightening programs in the computer corresponding to various chip types. Parameters can be pre-programmed based on user-provided chip samples.

5. Devices with the same lead pitch can use the same straightening comb without change. ICs with the same body size can use the same positioning fixture without replacement.

6. Quick changeover of chip positioning fixtures and straightening combs enables fast product switching, suitable for high-mix batch production.

7. Specially designed inclined-tooth straightening combs insert from the lead root to the device, improving alignment efficiency and reliability while reducing pre-straightening requirements.

8. Comprehensive system protection functions, including multiple warning signals, emergency stop, and automatic alarm.

9. Modular structure design for easy expansion, upgrade, and maintenance.

10. Straightening and repair monitored under a microscope to reduce eye strain.

11. Equipped with anti-static function to ensure electrostatic safety of the device being straightened.