Introduction to Laser Depaneling Machine

H315D Dual-Platform Laser Cutting Machine

The H315D adopts a dual-platform design, fully saving the time for loading and unloading materials, keeping the laser in a constant processing state. The H3 processing area is 350mm x 500mm, suitable for post-SMT depaneling and cover film windowing processes. It can also be equipped with a camera target pre-alignment system, eliminating the processing time occupied by target alignment.

With the rapid advancement of electronic technology, designers are assembling increasingly dense, smaller, and more numerous components onto smaller, thinner, and more irregular circuit boards, posing greater challenges to subsequent depaneling processes. To address this, Techwin offers a more environmentally friendly, efficient, precise, and reliable solution to meet the demands of this trend.

Narrow Laser Cutting Kerf:

UV laser is typically around 40μm, enabling compact (seamless) design without the need for process edges. This results in higher yield per unit area of substrate, saving 20-30% in material costs.

Stress-Free:

Rapid depaneling with no stress impact;

Precise Control of Thermal Influence:

Select the appropriate laser type and processing parameters based on different thermal influence requirements to minimize thermal effects;

Clean Processing:

Real-time laser fume extraction during processing minimizes the impact of fumes on circuit components.

Product Parameters