Product Introduction
The thermal conductivity tester developed using the Transient Plane Source (TPS) technology can be used to test the thermal conductivity performance of various types of materials. The Transient Plane Source method is the latest technique in the study of thermal conductivity, elevating measurement technology to a whole new level. It enables rapid and accurate measurement of thermal conductivity when studying materials, providing great convenience for enterprise quality control, material production, and laboratory research. The instrument is easy to operate, with a simple and understandable method, and does not cause damage to the tested samples.

Working Principle

Transient Plane Source (TPS) technology is a novel method for measuring thermal conductivity. Its principle for determining the thermal properties of materials is based on the transient temperature response generated by a step-heated disk-shaped heat source in an infinite medium. A planar probe made of a resistive material serves as both the heat source and the temperature sensor. The thermal resistance coefficient of the alloy has a linear relationship with temperature and resistance, meaning that by understanding the change in resistance, the heat loss can be determined, thereby reflecting the thermal conductivity of the sample. The probe used in this method is a thin sheet formed from conductive alloy through an etching process, featuring a continuous double-spiral structure. The outer layer consists of a double-layer insulating protective coating, which is very thin, providing the probe with mechanical strength and ensuring electrical insulation from the sample. During testing, the probe is placed between the samples. When current passes through the probe, it generates a certain temperature rise, and the produced heat diffuses into the samples on both sides of the probe. The rate of heat diffusion depends on the thermal conductivity characteristics of the material. By recording the temperature and the probe's response time, the thermal conductivity can be directly obtained through a mathematical model.

Test Objects

Metals, ceramics, alloys, ores, polymers, composite materials, paper, fabrics, foam plastics (insulating materials with flat surfaces, boards), mineral wool, cement walls, glass-reinforced composite panels (CRC), cement polystyrene boards, sandwich concrete, fiberglass panel composite boards, paper honeycomb panels, colloids, liquids, powders, granular and paste-like solids, etc. The range of test objects is extensive.

Main Features

uThe entire instrument references the standard: ISO 22007-2:2022;

uWide testing range and stable testing performance, placing it at a leading level among similar domestic instruments;

uDirect measurement, with a testing time adjustable between approximately 5-160 seconds, enabling rapid and accurate measurement of thermal conductivity, saving significant time;

uUnlike static methods, it is not affected by contact thermal resistance;

uNo special sample preparation is required, and there are no specific shape requirements for samples. For bulk solids, only a relatively smooth sample surface is needed, with the length and width being at least twice the diameter of the probe;

uNon-destructive testing of samples, meaning samples can be reused;

uThe probe is designed with a double-spiral structure, combined with a proprietary mathematical model, using core algorithms to analyze and calculate data collected from the probe;

uThe sample stage is cleverly structured, easy to operate, suitable for placing samples of different thicknesses, and is both simple and aesthetically pleasing;

uData acquisition on the probe uses imported data acquisition chips. The high resolution of these chips ensures more accurate and reliable test results;

uThe host's control system uses an ARM microprocessor, which has faster processing speed than traditional microprocessors, improving the system's analytical processing capabilities and making calculation results more precise;

uThe instrument can be used to measure the thermal properties of bulk solids, paste-like solids, granular solids, colloids, liquids, powders, coatings, films, insulating materials, etc.;

uIntuitive human-machine interface, displayed on a color LCD screen, with touch screen control, making operation convenient and straightforward;

uPowerful data processing capabilities. Highly automated computer data communication and report processing system.