FO Grinding Powder 1200#

Price:￥120 /kg

Industry Category:	Metallurgy & Minerals
Product Category:
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Spec:	1200

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Alumina Zirconia Composite Polishing Powder FO Grinding Powder 1200#

FO is an alumina zirconia composite polishing powder, characterized by combining the self-sharpening and toughness of both alumina and zirconia. The addition of silica and zirconia results in a moderate hardness of the polishing powder, preventing surface damage to wafers or crystals. It is suitable for grinding and polishing semiconductor materials such as gallium arsenide, gallium phosphide, silicon wafers, as well as optical lenses and optical glass.

Chemical Composition:

Component	Guaranteed Value	Typical Value
Al2O3	45-57%	50.88%
ZrO2	28-33%	32.11%
SiO2	11-20%	15.35%
TiO2	0.8-2.0%	1.03%
Fe2O3	＜0.1%	0.10%

Physical Properties:

Color	White
Specific Gravity	≥3.9g/cm3, Measured Value: 4.1-4.3g/cm3
Mohs Hardness	9.0

Production Specifications:

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≤ 10.0

Particle Size	D0 (Micron)	D3 (Micron)	D50 (Micron)	D94 (Micron)
#240	≤ 93.1	≤ 71.8	41.5±3.2	≥ 28.7
#280	≤ 81.4	≤ 64.1	35.2±2.7	≥ 22.8
#320	≤ 70.6	≤ 56.3	28.8±2.5	≥ 18.1
#400	≤ 64.3	≤ 50.2	24.6±2.3	≥ 15.5
#500	≤ 54.3	≤ 43.3	20.4±1.7	≥ 13.2
#600	≤ 46.3	≤ 37.4	17.1±1.4	≥ 11.0
#700	≤ 39.3	≤ 31.5	14.5±1.2	≥ 8.7
#800	≤ 33.3	≤ 27.5	12.0±1.0	≥ 7.0
#1000	≤ 21	≤ 14.7	10.3±0.3	≥ 7.0
#1200	≤ 18	≤ 11.8	7.2±0.3	≥ 4.2
#1500	≤ 14	≤ 10.0	5.8±0.5	≥ 3.5
#2000	≤ 13	≤ 9.0	4.7±0.5	≥ 2.6
#3000	≤ 6.3	3.7±0.4	≥ 1.7
#4000	≤ 8.5	≤ 5.4	2.8±0.4	≥ 1.5
#6000	≤ 8.0	≤ 5.0	2.0±0.4	≥ 0.8

Product Application Scope:

1) Electronics Industry: Grinding and polishing of semiconductor single-crystal silicon wafers, piezoelectric quartz crystals, and compound semiconductors (gallium arsenide, indium phosphide).

2) Glass Industry: Grinding and polishing of optical glass crystals.