Semiconductor integrated circuit COB packaging encapsulant potting compound
Price:電議
Contact Info
- Add:松江區(qū)松樂路128號, Zip:
- Contact: 陳工
- Tel:13817204081
- Email:hy_ccs168@163.com
Other Products
Description
Additional Information
Case Name: Semiconductor Integrated Circuit COB Packaging Filling Adhesive Encapsulation Adhesive
Application Point:COB Packaging Filling
Requirements:
Low-temperature curing, good fluidity, glossy after curing
Application Point Image:
Solution: One-component epoxy adhesive
| Industry Category | |
|---|---|
| Product Category | |
| Brand: | 金泰諾 |
| Spec: | |
| Stock: | 1000 |
| Manufacturer: | |
| Origin: | China / Shanghai / Songjiangqu |
