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China Latent liquid imidazole-type epoxy electronic underfill adhesive curing agent - China Supplier
China Latent liquid imidazole-type epoxy electronic underfill adhesive curing agent - China Supplier China Latent liquid imidazole-type epoxy electronic underfill adhesive curing agent - China Supplier China Latent liquid imidazole-type epoxy electronic underfill adhesive curing agent - China Supplier

Latent liquid imidazole-type epoxy electronic underfill adhesive curing agent

Price:Negotiable
Industry Category:
Product Category:
Brand: 金泰諾
Spec:


Contact Info
  • Add:松江區(qū)松樂路128號, Zip:
  • Contact: 陳工
  • Tel:13817204081
  • Email:hy_ccs168@163.com

Other Products

Description
Additional Information

Latent Liquid Imidazole-Type Epoxy Electronic Adhesive Underfill Curing Agent

Product Description

LH-01 is a modified imidazole-type epoxy curing agent with a core-shell structure, presenting as a viscous paste-like liquid at room temperature. It offers excellent stability, good dispersibility, and rapid low-temperature curing properties. The cured product exhibits performance typical of imidazole-cured materials, with a matte to semi-matte surface that is uniform and smooth. It can be applied in electronic adhesives, underfill adhesives, printed circuit board laminates, coatings, composite materials, and more.

Technical Specifications

Name

Appearance

Composition

Solid Content

Core-Shell Particle Size

(μm)

Dispersion Medium

LH-01

Brownish-yellow viscous liquid

Imidazole

Modification

100%

≤5

Epoxy Resin

Latent Liquid Imidazole-Type Epoxy Electronic Adhesive Underfill Curing Agent

Reference Formulation

Ratio

(128: LH-01 = 100:40)

(128: LH-01 = 100:50)

(128: LH-01 = 100:100)

Curing

Conditions

80℃

1 h

80℃

40 min

80℃

30 min

100℃

18 min

100℃

9 min

100℃

7 min

120℃

6 min

120℃

4 min

120℃

3 min

Adhesive storage stability: 40℃   One month

60℃   72 hours

Usage Instructions

As an epoxy curing agent, the usage amount is 40%-100% of the liquid epoxy resin (128). As an accelerator for dicyandiamide, hydrazides, etc., the usage amount is 1%-20% of the liquid epoxy resin (128). The dosage can be adjusted according to curing conditions. Avoid using a three-roll mill during application; simply mix thoroughly after adding to the system. Reactive diluents, water, and solvents may affect or compromise the adhesive's storage stability. If necessary, conduct tests to determine the extent of impact.

Packaging and Storage

5KG/drum. Store in a cool, dry place.

Shelf life at room temperature: 6-12 months; at 5℃: 2 years.

Latent Liquid Imidazole-Type Epoxy Electronic Adhesive Underfill Curing Agent


Industry Category
Product Category
Brand: 金泰諾
Spec:
Stock: 1000
Manufacturer:
Origin: China / Shanghai / Songjiangqu
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