| ■METAL FILM FIXED RESISTOR Metal Film Fixed Resistor |
■Stability Grade | 1%, 0.5%, 0.25%, 0.1% |
■Wide resistance range, high precision | 0.1 ohm - 10M ohm |
■Packaging | Available in bulk, tape (26mm, 52mm), formed and clipped leads |
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★ Applicable Standards:
▲ GB/T5729 (IEC115-1) Fixed resistors for electronic equipment, Part 1: Generic specification. Japanese JIS standard
▲ Q/RU270-2003 (Enterprise Standard) Detailed specification for metal film resistors, Assessment Level E |
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Structure: 1. Ceramic core. 2. Metal film 3. End cap 4. High insulation and solvent-resistant epoxy resin 5. Leads with good solderability. ★ Dimensions: |
Model | Resistor body size
(max) | Lead dimensions | D±1 | L±1 | d±0.05 | l±1 | 1/8W(1/6W)1/4WS | 1.5 | 3.2 | 0.40 | 26 | 1/4W 1/2WS | 2.3 | 6.2 | 0.43 | 26 | 1/2W 1WS | 2.8 | 8.5 | 0.50 | 26 | 1W 2WS | 3.8 | 10.5 | 0.6 | 26 | 2W 3WS | 4.3 | 14.5 | 0.65 | 26 | 3W 5WS | 5.5 | 16.5 | 0.70 | 30 | 5W 7WS | 8 | 24.5 | 0.75 | 35 | | | | | | |
★ Main Technical Specifications: ■METAL FILM FIXED RESISTOR Metal Film Fixed Resistor |
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Model | Rated power
(W) | Resistance range
(Ω) | Resistance tolerance
±(%) | Temperature coefficient
±(×10-6/℃) | Component limit voltage
(V) | Insulation voltage
(DC or AC peak)
(V) | 1/8W 1/4WS | 0.16 | 0.1—10M | 1(F), 2(G), 5(J)
0.1(B), 0.25(C), 0.5(D) | 5-100 | 150 | 500 | 1/4W 1/2WS | 0.25 | 0.1—10M | 1(F), 2(G), 5(J)
0.1(B), 0.25(C), 0.5(D) | 5-100 | 250 | 500 |
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1/2W 1WS | 0.5 | 0.1—10M | 1(F), 2(G), 5(J)
0.1(B), 0.25(C), 0.5(D) | 5-100 | 350 | 500 | 1W 2WS | 1.0 | 0.1—10M | 1(F), 2(G), 5(J)
0.1(B), 0.25(C), 0.5(D) | 5-100 | 500 | 500 | 2W 3WS | 2.0 | 0.1—10M | 1(F), 2(G), 5(J)
0.1(B), 0.25(C), 0.5(D) | 5-100 | 750 | 500 | 3W 5WS | 3.0 | 0.1—10M | 1(F), 2(G), 5(J)
0.1(B), 0.25(C), 0.5(D) | 5-100 | 800 | 500 |
★ Main Inspection Items, Methods, and Performance Requirements |
Inspection Item | Performance Requirement | Inspection Method | Temperature coefficient | ±(5-100)×10-6/℃ | -55℃ to +155℃ | Room temperature durability | ±（1%R+0.1Ω） | VR(or Umax) 1000h | Withstand voltage | No breakdown or flashover | V-block method, apply AC voltage with peak value of 1.42 times insulation voltage, t=1min | Solderability | Free flow of solder and wetting of leads indicates good solderability | Bath temperature: 235±5℃, immersion time: 2±5s | Overload | ±（0.5%R+0.05Ω） | Apply 2.5VR(or Umax), duration: 5s | Lead strength | ±（0.5%R+0.05Ω） | Tension: <0.5W:10N; 1W-3W:22.2N
Bending: 2 times
Twist: 180° 2 times | Soldering heat resistance | ±（0.5%R+0.05Ω） | Bath temperature: 350±10℃, immersion time: 3.5±5s | Rapid temperature change | ±（0.5%R+0.05Ω） | -55℃/+125℃ 5 cycles | Vibration | ±（0.5%R+0.05Ω） | Frequency: 10Hz to 500Hz, Amplitude: 0.75mm or 98m/s2 (whichever is smaller), Total duration: 6h | Climatic sequence | ±（1%R+0.1Ω） | Dry heat, cyclic damp heat (one cycle), cold, low pressure, cyclic damp heat (remaining cycles), DC load | Steady-state damp heat | ±（1%R+0.1Ω） | V=0.1√PR, T=40±2℃, Relative humidity (90-95)%, Time: 56 days | Upper category temperature durability | ±（1%R+0.1Ω） | V=0, T=155℃, Time: 1000h | Discharge test | ±20% | <0.5W:1mΩ to 68mΩ, 1W-3W:100KΩ to 68mΩ, According to UL1676 Section 6.3, Apply U=10KV, Capacitance Cd=0.001μf, Pulse period T=5 seconds, Total 50 times |
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