Indium10.1HF is a halogen-free, no-clean, lead-free solder paste capable of air reflow, specifically formulated to meet ultra-low voiding performance. This solder paste
is particularly suitable for designs with large bottom pads, also known as bottom termination components (BTC). Bottom termination components (BTC) include large-pad devices such as QFN, DPAK, and
MOSFET. The flux chemistry is designed to enhance reliability by minimizing voiding, maximizing
ECM and head-in-pillow defect resistance, while also demonstrating excellent wetting ability, prevention of solder balls/beading, and anti-slump performance (meeting IPC standards).
This flux is compatible with lead-free alloys such as SnAgCu, SnAg, and other alloy systems favored by the electronics industry.