Shenzhen Yingsaite Automation Equipment Co., Ltd. is a company specializing in industrial automation equipment, technical support, after-sales service, equipment leasing, installation and maintenance, solution development, and debugging inspection manufacturing. The company currently possesses multiple Vitrox 3D X-ray V810, AOI V510, and SPI V310 machines, along with a team of experienced engineers skilled in the sales, maintenance, fault diagnosis, and programming services of testing equipment. It is also a comprehensive enterprise engaged in the long-term research, development, and manufacturing of non-standard automation equipment, robotics, automated production lines, and logistics warehousing automation.

ViTrox 3D AOI/AXI Authorized Agent in China

3D V510 Online Optical Inspection System

3D V810 Online X-RAY Inspection System

Website:www.szyingsaite.com

Contact Number: 13924661275

New technology, simplified programming, and a dedicated POP key area reduce the setup time for POP slice height and improve the focusing accuracy for POP inspection.
2. Intelligent initialization learning: Self-learning function reduces initial program setup time.
3. Component package database: A shared intelligent package database across all production boards.
4. Second-generation slice imaging: Instantly view images of different slices in the defect analysis tool.
5. CAD creation: Create CAD documents using images from PCBA inspection or data from SMT placement machines.
6. Patented composite auto-focus technology: Automatically focus slices to the desired height without vertical movement of the X-ray tube or stage.
7. Solder joint profile feature map: Provides comprehensive systematic information for troubleshooting. Dynamic Range Optimization (DRO)
8. For components with very dark X-ray images or uneven grayscale levels, high-definition images can still be obtained using the DRO function.
9. Enhanced image clarity: Multiple image enhancement techniques provide clear images for bubble detection and re-inspection of multi-layer components.
10. 3D CT imaging: Both the V810 system and VVTS inspection station can be equipped with 3D model viewing tools.
11. Image restoration function (PSF): Improves the clarity of 2.5D images, allowing operators to increase test coverage. Bubble algorithm
12. Advanced algorithm with over 20 types of solder joint selections.
13. Phase Shift Profiling (PSP 2): Enhances test accuracy and coverage for press-fit connectors and through-hole device boards.
14. New bubble algorithm: Improves the precision of bubble detection for various component types, especially for pad components larger than 1 inch.
15. PTH inspection: The PTH inspection algorithm fully complies with IPC standards for through-hole solder wetting, and can slice up to 10 layers to determine the solder wetting height for PTH pins.
16. BGA: Adds 3 slice layers (totaling 6 layers) for BGA solder balls, improving the detection rate of HIP defects.
17. Broken pin algorithm: Capable of detecting broken pins in PTH and surrounding areas.
18. Easy re-inspection
ViTrox Verification Tool Solution (VVTS)
ViTrox Verification Tool Solution (VVTS)
A clear and straightforward defect verification tool makes it easier for operators to make accurate judgments.
Images from 14 angle cameras
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19. Automatic defect judgment: Defective solder joints can be automatically judged as faulty without requiring operator re-inspection.
20. Provides reference images of good products: Effectively improves the accuracy of operator re-inspection.
21. Image diagnosis: Highlights bubble areas and bubble area percentage.
22. PTH and BGA 2.5D images: Offers the industry's richest variety of angle images. Unified super server, speed improvement
23. Real-time calculation of precise slice height (PSH): The new PSH function reduces inspection time compared to the original PSH.
24. Single-core management: Improves hardware utilization and optimizes the efficiency of multi-core processors.
25. Intelligent optimized scanning path: Optimizes the scanning path and intelligently avoids areas without components.
26. Image Reconstruction Processor (IRP): A more powerful computing processing system reduces image reconstruction processing time.

Why choose Vitrox's AXI?
? The world's fastest 3D AXI testing system, bar none.
? Winner of 9 international awards within 6 years.
? The broadest test coverage, capable of inspecting the latest packaging materials on the market.
? User-friendly programming interface, along with the industry's most complete component package database.
? Low false call rate, easy maintenance.
? Highly compatible with Agilent 5DX & X6000 programs.
/ Series | Intelligent Link
/ Series embeds an intelligent system. By linking with downstream intelligent software on the production line, it enables new functionalities such as data statistical analysis, algorithm self-learning, and advanced graphical interface display.
Closed-loop feedback and monitoring
The centralized management mode shown in the diagram allows for more efficient collection of defect images, centralized programming, and centralized debugging. A single operator can manage multiple production lines, saving significant costs for the company.
Specifications
System V810iS2 V810i S2 XXL
System Controller Integrated controller, octa-core Intel Xeon processor Integrated controller, octa-core Intel Xeon processor
Operating System
Test Development Environment Windows 8 (64 bits) Windows 8 (64 bits)
User Interface Microsoft Windows-based software solution with a simple user interface and user-level password protection
Offline Programming Development Software Optional offline testing
Conversion Tool Optional software for converting CAD data to Vitrox format
Standard Test Development Time 4 hours to 1.5 days to convert original CAD files and develop applications
Production Line Integration V810iS2 V810i S2 XXL
Conveyor Height 823 mm - 980 mm 919mm - 1014mm
Standard Communication Conveyor Device SMEMA
Barcode Reader Compatible with most industry-standard barcode readers
System Performance Parameters*
Test Speed
Standard Image Acquisition Speed 51.68 cm2/sec (8 in2/sec) at 19μm
False Call Rate
Minimum Feature Detection Capability 500 -1000 ppm
Lead Pitch 1 0.3 mm and above 0.3 mm and above
Short Circuit Width 2 0.045 mm
Minimum Solder Thickness 0.0127 mm
Board Inspection Characteristics** V810i S2 V810i S2 XXL
Maximum Board Size 457 mm x 610 mm (18" x 24") 660mm X 965mm (26"x38")
Minimum Board Size 76mm X 76mm (3" x 3") 76mm X 76mm (3" x 3")
Maximum Board Inspectable Area 434mm X 610mm (17.1"x24") 654mm X 965mm (25.75"x38")
Maximum Board Thickness 4 mm (160 mils), 7 mm (280 mils) with fixture
3.5mm (140mils) high-resolution system 12.7mm (500mils)
Minimum Board Thickness 0.5mm (20mils) 0.5mm (20mils)
Board Warpage Downward bend < 2.0mm; Upward bend < 1.0mm Downward bend < 3.3mm; Upward bend < 3.3mm
Maximum Board Weight 4.5kg 15kg
Minimum Board Weight 0.03kg 0.03kg
Board Top Clearance 25mm @ 19μm resolution, 15mm @ 13μm resolution 25mm @ 19μm resolution,
10mm @ 11μm resolution 15mm @ 13μm resolution
* Top clearance measured from conveyor * Top clearance measured from board surface
Board Bottom Clearance 50mm 80mm
Board Edge Clearance 3.0mm 3.0mm
Board Width Tolerance +/-0.7mm +/-0.7mm
System Resolution 19μm/11μm 19μm/13μm
100% Press-Fit Component Testing Capability Yes (with PSP 2 function) Yes (with PSP 2 function)
Maximum Acceptable Board Temperature 40 °C 40 °C
Power and Environment V810i S2 V810i S2 XXL
Voltage Requirement 200 -240 VAC 3-phase; 380 - 415 VAC 3-phase wye (± 5) (50Hz or 60 Hz)
Compressed Air Requirement 552 kPa (80 psi) compressed air
System Dimensions (W x D x H) 1520mm X 1940mm X 1890mm 2240mm X 2460mm X 1980mm
System Weight ~3220kg ~5500kg
Safety Basic Standard X-ray radiation leakage < 0.5 μSv/hr


V810i S2EX Advanced 3D X-ray Inspection System (AXI)
Specifications
System
System Controller Operating System
Test Development Environment Integrated controller, octa-core Intel Xeon processor Windows 8 (64 bits)
User Interface Microsoft Windows-based software solution with a simple user interface and user-level password protection
Offline Programming Development Software Optional offline testing
Conversion Tool Optional software for converting CAD data to Vitrox format
Standard Test Development Time 4 hours to 1.5 days to convert original CAD files and develop applications
Production Line Integration
Conveyor Height 865 mm -1025 mm
Standard Communication Conveyor Device SMEMA
Barcode Reader Compatible with most industry-standard barcode readers
System Performance Parameters*
Test Speed
Standard Image Acquisition Speed 51.68 cm2/sec (8 in2/sec) at 19μm
False Call Rate
Minimum Feature Detection Capability 500 -1000 ppm
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