Micro-focus X-ray Non-destructive Testing Equipment

X-RAY non-destructive testing instrument is mainly used for: semiconductor components, BGA, CPU, PCBA, IC chips, electronic components, packaged components, integrated circuits, capacitors,

thermistors, mobile phone circuits, batteries, circuit boards, checking for deformation, empty soldering, desoldering, fractures, displacement, and other non-destructive testing of internal structures in electronic products;

It can also be used for: internal structure inspection of heating tubes and heating wires, inspection of castings, die castings, injection molded parts, pores, bubbles, etc.

Technical Parameters:

1. Digital imaging field of view: 130X160mm (customizable for different areas)       

2. Pixel pitch: 125um (high-resolution imaging system)         

3. Distance: 200-600mm;        

4. A/D conversion: 16/bits           

5. Spatial resolution: 10.LP/mm (high resolution)

6. Tube voltage: 40-80kv (micro-focus X-ray machine)         

7. Tube target current: 0.2-0.5mA;

8. Computer system: Windows 10;

9. Remote control: Remote operation software;

10. Wired transmission port: Gigabit Ethernet port;

11. Host weight: 210kg;           

12. Adapter output voltage: DC24V.

13. AC power frequency: 50-60hz;