X-ray Inspection System

Instrument Features:

Multifunctional X-ray inspection system for aperture measurement, thickness measurement, electronic components, packaged components, semiconductor components

BGA, CPU, PCBA, IC chips, integrated circuits, connectors, heating wires, circuit boards, heating tubes, heating wires, deformation of electronic products, desoldering

Void soldering displacement, porosity, bubbles, and other tests

Instrument Technical Parameters:

1. Digital Imaging Field of View: 116X146mm (customizable for different areas)       

2. Pixel Pitch: 49.5μm (high-resolution imaging system)         

3. Distance: 200-600mm        

4. A/D Conversion: 16 bits           

5. Spatial Resolution: 10 LP/mm (high resolution)

6. Tube Voltage: 40-60kV (microfocus 5μm X-ray source)         

7. Tube Target Current: 5mA

8. Computer System: Windows 10

9. Remote Control: Remote operation software

10. Wired Transmission Port: Gigabit Ethernet port

11. Host Weight: 210kg           

12. Adapter Output Voltage: DC24V

13. AC Power Frequency: 50-60Hz