X-RAY Inspection Equipment for Electronic Component and Chip Detection

X-ray inspection devices are primarily used for: chips, electronic components, packaged components, semiconductor components, BGA, CPU,

PCBA, IC, integrated circuits, capacitors, thermistors, connectors,

heating wires, circuit boards, heating tubes, heating wires, detecting internal structural deformations, desoldering, empty solder joints, displacement, etc. in electronic products;

They can also be used for non-destructive testing of castings, die-castings, injection moldings, pores, bubbles, aperture size, and more.