High-temperature resistant acrylic pressure-sensitive adhesive, resistant to high temperatures without leaving residue, minimal impact on dyne value, low peel force increase, easy to peel, and residue-free.

High-temperature resistance, no residue or bubbling after 1 hour at 280°C with hot and cold peeling, low peel force increase, no silicon contamination   no silicon residue, peel force adjustable from 3g to 1000g, peel force increase after high temperature <2 times, peel force <20g after 10 days of dual 85 conditions, resistant to acids, alkalis, and etching. Suitable for various copper foil process protections, such as FPC processes, lithium battery copper foil processes, and screen copper foil process protection.

With the continuous development of modern technology, the application of copper foil is becoming increasingly widespread. Today, we not only see copper foil in traditional industries such as circuit boards, batteries, and electronic appliances but also in more cutting-edge fields like new energy, integrated chips, high-end communication, and aerospace. Copper foil is also becoming thinner. To facilitate production and processing while protecting the surface of the copper foil, more and more process steps require protective films. These films must leave no residue and remain easy to remove after processes such as etching, alkaline washing, and high-temperature hot pressing. This demands pressure-sensitive adhesives with excellent high-temperature resistance, low peel force increase, and silicon-free composition to avoid impacting subsequent processes.