Q75

Price:Negotiable

Industry Category:
Product Category:	Electroplating Additives for Lithium Battery Copper Foil
Brand:	WinChem
Spec:

Send Inquiry Contact Info

Product List About Us

Description

Additional Information

Metal Complexing Agent Q75

Metal Complexing Agent Q75

Product Description

Chemical name: N,N,N',N'-Tetrakis(2-hydroxypropyl)ethylenediamine
CAS Number: 102-60-3
Appearance: colorless to pale yellow viscous liquid
M.W.: 292.42
pH: 8.0–10.0 (1% aqueous solution)
Assay (%): 75.0
Solubility: miscible with water in any proportion to form a clear and transparent solution

Product Applications

Printed Circuit Board (PCB) Electroless Copper Plating: As an efficient metal complexing agent, it forms stable complexes with copper ions, controls the deposition rate, and enables hole wall metallization. It is a key additive in the PCB electroless copper deposition process.
Alkaline Zinc-Nickel Alloy Plating: Used as a complexing agent for zinc-nickel alloys, it helps achieve a more stable and higher-performance alloy coating. It is primarily used in applications requiring high corrosion resistance, such as automotive components.
Flux and Cleaner: With good wetting and cleaning properties, it is used in flux and industrial cleaner formulations to improve soldering quality and surface cleanliness.